This week Advanced Micro Devices (AMD) is set to release its 380MHz K6-III-P mobile processor, the fastest x86 mobile PC processor on the market. Also available in 366MHz and 350MHz versions, the AMD K6-III-P processor competes with Intel's mobile Pentium III and mobile Pentium II Dixon chips, say AMD officials.
The K6-III-P processor leverages AMD's TriLevel Cache design, sixth-generation micro-architecture, and a 100MHz frontside bus. By comparison, Intel's mobile PII Dixon chips feature a 66MHz frontside bus. AMD's K6-III-P also has double the L1 cache of Intel's fastest mobile Celeron and PII chips.
"With its bigger cache and higher clock speed, the mobile K6-III-P is extending the high performance, sub-$US2,000 notebook space," says Martin Reynolds, a mobile computing analyst with the market research firm Dataquest.
And the K6-III-P has the same footprint as the company's K6-2 mobile chip. "The mobile AMD K6-III-P is compatible with (our) existing Super7 platform infrastructure," says Martin Booth, product marketing manager for AMD's mobile processing division. Because AMD's new mobile chip is PIN-compatible with existing K6-2 notebooks, vendors won't have to invest in a new design, Booth says.
Introduced earlier this year with the mobile K6-2 chips, AMD's 3DNow technology also figures prominently into the mobile K6-III-P design. 3DNow enhances 3D graphics, soft DVD playback and speech recognition.
The mobile K6-III-P operates at a core voltage of 2.2 volts with an extended case temperature rating of 80 degrees Celsius compared to a 1.6 core voltage and 100 degree Celsius case temperature for Intel's latest 366MHz mobile Celeron. Intel uses Voltage Reduction technology to optimise performance at lower power levels.
"The only downside to AMD's new mobile chips is that the power meter is still a little high," says Reynolds. "They are not suitable for ultrathin and light mini notebooks