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Intel Invests US$650 Million In U.S. Manufacturing Site

  • 25 October, 2005 12:23

<p>Company to Add 300mm Wafer Capacity at New Mexico Fab</p>
<p>SYDNEY, Australia, Oct. 25, 2005 – Intel Corporation today announced plans to invest US$650 million in the company's existing manufacturing site in New Mexico. The investment will be used to increase the capacity of the 300mm wafer fabrication facilities in Rio Rancho, N.M., called Fab 11X.</p>
<p>"Today’s announcement signals another important addition to one of Intel’s pre-eminent U.S. manufacturing sites, and better positions us to meet customer requirements," said Intel President and CEO Paul Otellini. "Additional 300mm wafer manufacturing capability helps improve the overall cost-effectiveness of our worldwide manufacturing network. Investing in an existing manufacturing site allows us to take advantage of our highly skilled workforce in New Mexico."</p>
<p>Construction and new tool installations are scheduled to continue through 2006, with production operations set to begin through the new expansion in early 2007. This investment in New Mexico will result in the creation of more than 300 new manufacturing jobs.</p>
<p>This investment is part of Intel’s strategic goal to increase manufacturing on 300mm wafers that use 90nm, 65nm and future process technologies. Intel has several fabs manufacturing with 300mm wafers today. These facilities are Fab 11X in New Mexico, D1D and D1C in Oregon and Fab 24 in Ireland.</p>
<p>Manufacturing with 300mm wafers (about 12 inches in diameter) dramatically increases the ability to produce semiconductors at a lower cost compared with more widely used 200mm (eight-inch) wafers. The total silicon surface area of a 300mm wafer is 225 per cent, or more than twice that of a 200mm wafer, and the number of printed die (individual computer chips) is increased to 240 per cent. The bigger wafers lower the production cost per chip while diminishing overall use of resources.</p>
<p>“With each subsequent technology process, Intel improves its designs to further reduce impacts to the environment,” said Tim Hendry, Intel Technology and Manufacturing vice president and Fab 11X factory manager. “Manufacturing with 300mm wafers uses 40 per cent less energy and water per chip.”</p>
<p>Intel, the world’s largest chip maker, is also a leading manufacturer of computer, networking and communications products. Additional information about Intel is available at www.intel.com/pressroom.</p>
<p>– 30 −</p>
<p>Intel is a trademark or registered trademark of Intel Corporation or its subsidiaries in the United States and other countries.</p>
<p>*Other names and brands may be claimed as the property of others.</p>
<p>For further information please contact:</p>
<p>Daniel Anderson</p>
<p>Intel Australia Pty Ltd</p>
<p>Tel: +61 2 9937 5886</p>
<p>Mob: +61 0418 686 775</p>
<p>Email: daniel.anderson@intel.com</p>
<p>Marty Filipowski</p>
<p>Spectrum Communications</p>
<p>Tel: +61 2 9954 3299</p>
<p>Email: martyf@spectrumcomms.com.au</p>

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