Intel has become the first chip manufacturer to ship microprocessors using 300 millimetre (mm) wafers on 0.13-micron technology.
The microprocessors, which will be used for mobile, desktop and server applications, were produced at the company's new 300mm wafer factory in the US.
In the company's press statement, Intel senior vice president and general manager of its technology and manufacturing group, Sunlin Chou, said the new microprocessors cost 30 percent less than those made using the smaller 200mm wafers. By combining the larger wafers with the company's 0.13-micron process, Intel claims it can quadruple the output per wafer compared to that of the prior process generation, she said.
The bigger wafers also cut back overall demand on resources, using 40 per cent less energy and water per chip than their 200mm predecessors.